CXMT says G5 DRAM platform is in mass production

ChangXin Memory Technologies (CXMT) said its fifth-generation DRAM manufacturing platform has entered mass production and showed two 24-gigabit LPDDR5X chips already in volume production for smartphones and other portable devices.

HARDWARE desk — Memory chips sit under every AI and phone workload. A Chinese DRAM supplier claiming a denser, higher-die-count mass-production node matters because the global market is still dominated by Samsung, SK Hynix, and Micron — so any credible extra source of advanced DRAM changes how buyers and governments think about supply risk, even when the first chips are phone memory rather than AI HBM.

The company unveiled two 24-gigabit LPDDR5X products made on G5 — a 496-ball package and a 245-ball package — and said both are already in volume production for smartphones and other portable electronics. LPDDR5X is a lower-power kind of DRAM used mainly in phones and other portable devices.

CXMT said each 24Gb product holds 50% more data than its previous equivalent products.

CXMT said G5 uses quadruple patterning to shrink the active-area half-pitch in the memory array to 11.95 nanometers. Half-pitch here is a spacing measurement inside the memory array — how close the data-storing features sit — not a logic-chip “node name” like the 2nm label on a phone processor. Luo Xiaodong said process capability is “on par with the most advanced mass-produced nodes” in the industry. “On par” is his wording — not a desk ranking versus Samsung, SK Hynix, or Micron.

CXMT said the platform can produce at least 50% more gross dies per wafer than its fourth-generation platform, using an 8-gigabit-chip baseline before defect screening. A die is one chip cut from a silicon wafer. Gross dies means the potential number of chips on the wafer before broken units are thrown out — a die-count claim, not a final yield claim, and not a promise that 50% more good chips ship.

DRAM — dynamic random-access memory — is the short-term working memory phones, computers, and other devices use to run apps and programs. This filing is about CXMT’s mobile and portable LPDDR5X products. No source in this pack says that.

Context only.S. Export controls since 2022 have limited access to some advanced chipmaking tools.

Plain English for the rest of the card: DRAM = short-term working memory. LPDDR5X = a lower-power DRAM used mainly in phones and portable devices. G5 = CXMT’s fifth-generation manufacturing platform. die = one chip cut from a wafer. wafer = the round silicon disc chips are printed on. gross dies = chips counted before defect screening — not final yield. quadruple patterning = repeating process steps to print finer features. half-pitch = spacing of features in the memory array. 24Gb = 24 gigabits of data on one chip. HBM = high-bandwidth memory for AI accelerators — not what this card is filing. 688825.SS = CXMT’s STAR Market ticker. Luo Xiaodong = CXMT vice president, named at the Hefei convention.