Hanwha lists PLUS Korea HBM and AI semiconductor materials ETFs

Hanwha Asset Management listed PLUS Korea HBM Semiconductor and PLUS AI Semiconductor Materials·Parts·Equipment Active on the Korean market. Issuer PLUS ETF listing-day reports (dated 9 Sep, titled for the 15 Sep listing) describe a passive HBM-focused basket and an actively managed Korean semiconductor materials/parts/equipment sleeve. Same-day Korean business press citing the firm says the HBM fund targets about 50% in Samsung Electronics and SK hynix with the rest in domestic suppliers, with cited annual fees of 0.45% (HBM) and 0.63% (active).

This completes the same-day Korea AI ETF listing cluster with the HBM memory and domestic chip-supply angle, after HANARO agentic-AI and KODEX U.S. AI memory. That is listed-product demand around AI hardware — not a tip sheet.

Hanwha Asset Management listed PLUS Korea HBM Semiconductor and PLUS AI Semiconductor Materials·Parts·Equipment Active on the Korean market on 15 Sep 2026. The Korean product names are PLUS 코리아HBM반도체 and PLUS AI반도체소부장액티브. An ETF, or exchange-traded fund, is a basket of stocks you can buy like a single share. PLUS is Hanwha Asset Management’s ETF brand. HBM means high-bandwidth memory — stacked memory chips that feed data fast to AI accelerators. 소부장 is Korea’s shorthand for the materials, parts, and equipment supply chain that builds chips. These are Korea-listed products — not New York or Nasdaq listings of the funds themselves. That issuer listing-day pair of PLUS ETF Weekly View reports, plus same-day Korean business press and a Yonhap KRX listing notice, is the filing event. These are issuer and press claims.

The issuer Weekly View for the HBM ETF (report n=2090, page dated 9 Sep, titled for the 15 Sep listing) frames HBM as AI-critical high-bandwidth memory and asks what to own beyond Samsung Electronics and SK hynix in the Korean memory and HBM chain.

The issuer Weekly View for the active ETF (report n=2091, same page-date and listing-day title) frames Korean semiconductor materials, parts, and equipment bottlenecks across front-end and back-end as the investment problem the active sleeve is meant to track. Front-end is the wafer-making side of a chip plant. Back-end is packaging and testing.

Same-day Seoul Economic Daily and Asia Business Daily, citing the firm: PLUS Korea HBM Semiconductor allocates about 50% to Samsung Electronics and SK hynix and about 50% across eight domestic suppliers, including PSK, VM, TES, Wonik IPS, Simmtech, Jusung Engineering, Isu Petasys, and Daeduck Electronics. Weights can move.

Those same-day stories, still citing the firm: the active sleeve is manager-selected among Korean chip-supply names using capital expenditure (CAPEX — factory and equipment spend), equipment orders, mass-production schedules, and related criteria. Example names cited in the press include Isu Petasys, Intekplus, Doosan, ISC, SFA Semicon, TES, DI, Psk Holdings, Simmtech, and Hansol Chemical.

IT Chosun’s weekly listed-ETF roundup (pre-listing, 13 Sep) cites annual total fees of 0.45% for Korea HBM and 0.63% for the AI materials active sleeve, and a planned unit price of ₩10,000. Yonhap’s 11 Sep KRX listing notice also says the 15 Sep quartet — Hanwha’s two, plus Samsung’s and NH-Amundi’s — is scheduled at ₩10,000 a unit. File 0.45% and 0.63% as Korean specialist press on listing specs, not as desk-verified NAV. File ₩10,000 as the scheduled unit price in that press and the Yonhap schedule.